Deepthi Computers Ameerpet Hyderabad

Demanding space and weight requirements of personal computing and portable electronic equipment has led to many innovations in IC packaging. Combining the right interface and logic products with new package technology can have a significant impact on the capabilities and form factor of the end product. Leaded surface mount devices are constantly pushing the manufacturing capabilities of leading board manufacturers to finer and finer lead pitch geometry’s to increase I/O density and reduce board space. This requirement has lead to significant interest in the JEDEC (Joint Electron Device Engineering Council) registered Fine-Pitch Ball Grid Array (FBGA) package. These Packages are ideally suited to low cost, high volume applications, where package size and performance is of major importance.